NCT210
http://onsemi.com
15
PACKAGE DIMENSIONS
QSOP16
CASE 492
ISSUE A
E
M
0.25
C
A1
A2
C
DETAIL A
DETAIL A
h x 45_
DIM
MAX
MIN
INCHES
A
0.053
0.069
b
0.008
0.012
L
0.016
0.050
e
0.025 BSC
h
0.009
0.020
c
0.007
0.010
A1 0.004
0.010
M
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT EX?/DIV>
CEED 0.005 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION. IN?/DIV>
TERLEAD FLASH OR PROTRUSION SHALL NOT EX?/DIV>
CEED 0.005 PER SIDE. D AND E1 ARE DETERMINED
AT DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
_
_
b
L
6.40
16X
0.42
16X
1.12
0.635
DIMENSIONS: MILLIMETERS
16
PITCH
SOLDERING FOOTPRINT*
9
1
8
D
D
16X
SEATING
PLANE
0.10
C
E1
A
A-B
D
0.20
C
e
1
8
16
9
16X
C
M
D
0.193 BSC
E
0.237 BSC
E1
0.154 BSC
L2
0.010 BSC
D
0.25
C
D
B
0.20
C
D
2X
2X
2X 10 TIPS
0.10
C
H
GAUGE
PLANE
C
A2 0.049
----
1.35
1.75
0.20
0.30
0.40
1.27
0.635 BSC
0.22
0.50
0.19
0.25
0.10
0.25
0
8
_
_
4.89 BSC
6.00 BSC
3.90 BSC
0.25 BSC
1.24
----
MAX
MIN
MILLIMETERS
L2
A
SEATING
PLANE
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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